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PT. ADIMINDO REKAJAYA
Pembina Graha Building Blok 2#101#
Jl. DI. Panjaitan No. 45, Jakarta 13350, INDONESIA
Tel.:(021)29389005, 29389006
Mobile:0852-82316618
Fax.:(021)29389006
Email: sales@adimindo.com, adimindo@cbn.net.id
product - PACE,SOLDERING-DESOLDERING - Area Array Rework System

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TF2800 BGA and SMD Rework System
Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 2800 BGA/SMD Rework System. With its groundbreaking, patent-pending Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.