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product - PACE,SOLDERING-DESOLDERING - Area Array Rework System

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TF2800 BGA and SMD Rework System
Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, todays extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACEs TF 2800 BGA/SMD Rework System. With its groundbreaking, patent-pending Inductive-Convection Heating Technology, the TF 2800s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.